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1. CMOS circuit design, layout, and simulation / R. Jacob Baker, Harry W. Li, and David E. Boyce.

by Baker, R. Jacob, 1964- | Li, Harry W, 1960- | Boyce, David E, 1940- | Institute of Electrical and Electronics Engineers.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York : IEEE Press, c1998Online access: Contributor biographical information | Publisher description | Table of Contents Availability: Items available for loan: Ebook Repository [Call number: 621.3815] (1).

2. Computer chips [electronic resource] : post-Moore's-law possibilities.

by ebrary, Inc.

Material type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Boston, Mass. : Technology Research News, 2003Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: HEC Digital Library (1).

3. Radio-Frequency Integrated Circuit Engineering

by Nguyen, Cam.

Material type: book Book Publisher: New York: Wiley, 2015Online access: Click here to access online Availability: Items available for loan: Multimedia Section (1), HEC Digital Library [Call number: 621.382] (1).

4. Terrestrial radiation effects in ULSI devices and electronic systems /

by Ibe, Eishi H.

Material type: book Book Online access: Click here to access online Availability: Items available for loan: Multimedia Section (1).

5. Fundamentals of silicon carbide technology :

by Kimoto, Tsunenobu | Cooper, James A.

Material type: book Book Online access: Click here to access online Availability: Items available for loan: Multimedia Section (1).

6. Electromigration in ULSI Interconnections /

by Tan, Cher Ming.

Material type: book Book Publisher: Singapore ; Hackensack, NJ : World Scientific, c2010Online access: Click here to access online Availability: Items available for loan: HEC Digital Library (1).

7. Design and modeling for 3D ICs and interposers /

by Swaminathan, Madhavan | Han, Ki Jin.

Material type: book Book Online access: Click here to access online Availability: Items available for loan: Multimedia Section (1).


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