Lau, John H.
Microvias : for low-cost, high-density interconnects - 1st ed. - [S.l.] : McGraw-Hill Professional, 2001. - 565 p. ;
0071363270 (hardcover) 9780071363273 (hardcover)
Printed circuits
Microelectronic packaging
Semiconductors--Junctions
Integrated circuits--Design and construction--Cost control
Microelectronics--Materials
Solder and soldering
Solder and soldering--Testing
Micro-drilling
Microvias : for low-cost, high-density interconnects - 1st ed. - [S.l.] : McGraw-Hill Professional, 2001. - 565 p. ;
0071363270 (hardcover) 9780071363273 (hardcover)
Printed circuits
Microelectronic packaging
Semiconductors--Junctions
Integrated circuits--Design and construction--Cost control
Microelectronics--Materials
Solder and soldering
Solder and soldering--Testing
Micro-drilling